“A combination of design review and simulation allowed us to determine what was causing the solder joint failure and provide our customer with detailed recommendations on how to prevent the failure from reoccurring.” Mike Howard Reliability Engineering Services Manager / Ansys Ansys Reliability Engineering Services Team Identifies Root Cause of Failure for Electronics Manufacturer CASE STUDY /2 Ansys Reliability Engineering Services Team Identifies Root Cause of Failure for Electronics Manufacturer // The Ansys Reliability Engineering Services (RES) team (formerly DfR Solutions) was contacted by a leading electronic instrument manufacturer to determine why their printed circuit board assemblies (PCBAs) were experiencing early solder fatigue failure during thermal cycling. Ansys RES

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