HETEROGENEOUS PACKAGING FOR CUSTOM MULTI-CHIP MODULE. FIRST PROTOTYPES BUILT IN ONLY 48 HOURS.
HETEROGENEOUS PACKAGING FOR CUSTOM MULTI-CHIP MODULE. FIRST PROTOTYPES BUILT IN ONLY 48 HOURS.
2 PagesIn pursuit of terabit/s pluggable applications, a tier-one communications company developed disruptive semiconductor die and silicon photonic chips, requiring a partner to design a highly customized heterogeneous multi-chip module (MCM) package using flip-chip technology—in parallel with die fabrication—for faster time-to-market. The challenge stemmed from skyrocketing interconnect density demands alongside growing die sizes within fixed package areas. Sanmina's advanced software streamlined the intricate heterogeneous packaging design, empowering the team to build first prototypes in just 48 hours and accelerate product launch.
