Sarcina achieved right-first-time semiconductor packaging success by leveraging Keysight’s Advanced Design System (ADS) to perform integrated chip-package-board simulation. Tackling the immense signal and power integrity challenges inherent in modern multi-chip modules, the team utilized Keysight’s robust software to model complex electromagnetic interactions across the entire interconnect path. Keysight’s software proved instrumental, providing the high-fidelity analysis needed to predict and mitigate performance bottlenecks before physical prototyping. This software-driven methodology minimized expensive design iterations and ensured optimal electrical performance. By adopting this streamlined, simulation-based workflow, Sarcina significantly accelerated its product development cycles wh

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