This solution brief presents 3D Interconnect Designer as a physically aware environment for evaluating complex 2.5D and 3D interconnect architectures before layout. Engineers can model microbumps, vias, buses, breakout structures, ground planes, return paths, silicon or organic interposers, and multi-chiplet routing constraints. The platform supports UCIe, BoW, and user-defined bump maps while identifying impedance mismatches, coupling, bandwidth limitations, congestion, and grounding discontinuities early. Automated breakout routing, multilayer alignment, Python-based parameter sweeps, batch simulations, and open API integration accelerate design-space exploration. Automated HTML reports improve collaboration among architecture, packaging, and signal-integrity teams, reducing late redesig

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