The VIAVI TestCenter Data Center Bundle for AION supports high‑performance, realistic Layer 2 and Layer 3 overlay topologies, data center interconnects, multipath high‑availability designs, and modern switching and storage technologies. It enables manufacturers, service providers, and enterprises to quickly evaluate and troubleshoot the functionality, performance, and scalability of any data center fabric. By exposing the true behavior of high‑speed, high‑density switches, routers, and system architectures under diverse traffic conditions, the bundle helps validate readiness for increasing port speeds and densities common in modern data centers.

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