This paper explores the symbiotic relationship between AI and semiconductor development. It details advances such as neuromorphic computing, chiplets, 3D stacking, and high-bandwidth memory enabling faster, energy-efficient processing. AI, in turn, drives semiconductor innovation by demanding new materials and architectures. The paper discusses challenges like scaling below 5nm and opportunities in edge AI, quantum-inspired design, and custom accelerators. HCLTech urges collaboration between academia, startups, and industry to sustain innovation leadership.

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